Title: |
The 24th Sensor Symposium on Sensors,
Micromachine and Applied Systems |
Date: |
October 16 & 17, 2007 |
Venue: |
Tower Hall Funabori, Edogawa, Tokyo
|
Sponsored by: |
Sensors and Micromachine Sub-Society
of the Institute of Electrical Engineers of Japan
|
Co-Sponsored by: |
The Electrochemical Society of
Japan, The Institute of Electronics, Information and Communication
Engineers, The Institute of Systems, Control and Information Engineers,
The Ion Engineering Society of Japan, The Japan Society for Precision
Engineering, The Japan Society of Applied Physics, The Japan Society of
Infrared Science and Technology, The Japan Society of Mechanical
Engineers, Japan Society of Medical Electronics and Biological
Engineering, The Japan Society of Next Generation Sensor Technology,
The Laser Society of Japan, New Ceramics Forum, Reliability Engineering
Association of Japan, The Robotics Society of Japan, The Society of
Instrument and Control Engineers, The Society of Sensing Technology of
Japan, The Vacuum Society of Japan and Related Technical Committees of
IEEJ
|
General Chair: |
Koichi Imanaka (Omron Corporation) |
Program Chair: |
Gen Hashiguchi (Kagawa University)
|
URL: |
http://www2.iee.or.jp/%7Esmas/Sensor_Sympo/24/index.html
|
Steering Committee
General Chair |
Koichi Imanaka (Omron Corporation) |
Secretariat |
Toshiyuki Toriyama (Ritsumeikan
University) |
Secretariat |
Sho Sasaki (Omron Corporation)
|
Program Chair |
Gen Hashiguchi (Kagawa University) |
Program Vice Chair |
Toshiyuki Tsuchiya (Kyoto University) |
Program Secretariat |
Hidekuni Takao (Toyohashi University
of Technology) |
Finance Chair |
Hideto Iwaoka (Kanazawa Institute of
Technology) |
Local Arrangement Chair |
Yoshinori Matsumoto (Keio University) |
Local
Arrangement Vice Chair |
Norihisa Miki (Keio University) |
Exhibition Chair |
Masafumi Kimata (Ritsumeikan
University) |
Program Committee
Secretariat |
Sho Sasaki (Omron Corporation)
|
Program Chair |
Gen Hashiguchi (Kagawa University) |
Program Vice
Chair
|
Toshiyuki Tsuchiya (Kyoto University) |
Members |
Hiroshi Adachi (Muroran Institute of
Technology)
Kenjiro Ayano (Aoi Electronics Co., Ltd.)
Hirofumi Funabashi (Toyota Central Res.& Dev. Lab., Inc.)
Takeshi Harada (Hitachi Ltd.)
Kazuhiko Hashimoto (Matsushita Electric Industrial Co., Ltd.)
Eiji Higurashi (The University of Tokyo)
Masaki Hirota (Nissan Motor Co., Ltd.)
Tsutomu Horiuchi (NTT Microsystem Integration Laboratories)
Hideto Iwaoka (Kanazawa Institute of Technology)
Hiroshi Kezuka (Tokyo University of Technology)
Masafumi Kimata (Ritsumeikan University)
Setsuo Kodato (Tokyo Institute of Technology)
Akihiro Koga (Toshiba Corporation)
Kazusuke Maenaka (University of Hyogo)
Ryutato Maeda (AIST)
Yoshinori Matsumoto (Keio University)
Norihisa Miki (Keio University)
Yuji Miyahara (National Institute of Materials Science)
Hiroshi Miyajima (Olympus Corporation)
Toyosaka Moriizumi (Tokyo Institute of Technology)
Yuji Murakami (Hiroshima University)
Takamichi Nakamoto (Tokyo Institute of Technology)
Hiroaki Nakanishi (Shimadzu Corporation)
Takahiro Namazu (University of Hyogo)
Takahito Ono (Tohoku University)
Fumikazu Oohira (Kagawa University)
Osamu Oshiro (Osaka University)
Tomomi Sakata (NTT Microsystem Integration Laboratories)
Seiji Samukawa (Tohoku University)
Sho Sasaki (Omron Corporation)
Minoru Sasaki (Toyota Technological Institute)
Kazuaki Sawada (Toyohashi University of Technology)
Renshi Sawada (Kyushu University)
Mitsuhiro Shikida (Nagoya University)
Hiroyuki Shinoda (The University of Tokyo)
Shuichi Shoji (Waseda University)
Hiroaki Suzuki (University of Tsukuba)
Yuji Suzuki (The University of Tokyo)
Shoji Takeuchi (The University of Tokyo)
Yukihiro Takeuchi (Denso Corporation)
Jun Tamaki (Ritsumeikan University)
Shuji Tanaka (Tohoku University)
Toshiyuki Toriyama (Ritsumeikan University)
Yoshinori Uchikawa (Tokyo Denki University)
Kaoru Yamashita (Osaka University)
Yukihisa Yoshida (Mitsubishi Electric Corporation)
|
Organized
Session |
Hidetoshi Kotera (Kyoto University)
Kazusuke Maenaka (University of Hyogo)
Kiyoshi Matsumoto (The University of Tokyo)
|
The symposium will present recent scientific and technological results
on all aspects of the theory, design, fabrication and application of
sensor and micromechanical systems, and promote exchange of ideas and
techniques among the scientists. This year, there will be four
organized sessions on special topics, which are 1. MEMS-CAD,
2. Sensor Integration, and 3.
Nano-imprint and MEMS.
Japanese and English are to be used in the presentations. Symposium
proceedings will be published in English.
Accepted papers are to be presented in Oral or Poster
presentations.
Presenters may use Japanese or English for presentation.
Oral Presentation: Authors will have 20
minutes for oral presentation including 5 minute discussion with
audience. Presentation rooms will be provided with overhead projector
and PC projector.
Poster Presentation: Authors are to
present their papers as posters. During poster session, authors are to
stand by their posters to have discussion with audience.
Igarashi award is presented to commend a
paper presented by young researchers, aged 35 years or younger at the
time of Symposium.
Best Poster Award is presented to the
best poster presenter.
Best Technical Exhibition Award is
presented to the best technical exhibitor.
PAPER
SUBMISSION IS NOW CLOSED. ONLY LATE NEWS PAPERS ARE ACCEPTED NOW. (see below)
Authors wishing to present a paper at the symposium should submit the
following materials. All accepted papers must be presented at the
conference.
1)4 copies of an abstract, with a title and a summary
not exceeding 500 words on one page. For figures you may use the other
side. Please type your abstract on A4 size or the legal letter size
paper. Explain originality and usefulness of your work. Names and
affiliations of authors should not appear on the abstract.
2)1 copy of application form containing the following
information
1. title of the paper
2. names of all authors
3. name and date of birth of the presenter (required for screening
purpose of the Igarashi Award*)
4. mailing address of a contact person
5. telephone and facsimile numbers, and E-mail address of the above
contact person
6. topic code number(s) selected from the list below
7. preference for poster or oral presentation
A sample of application form (PDF format) is available
from here.
The abstract should be sent to:
The 24th Sensor Symposium,
c/o ECHIZEN, Tokan Shinjuku Bldg. 603, Nishi-Shinjuku 3-6-5, Shinjuku,
Tokyo, 160-0023, Japan
fax 81-3-3346-8002, phone 81-3-3346-8007, SMAS@conferences.jp
Deadline for abstract submission is Friday, June 1, 2007.
Organized
Session |
TOPIC |
OR1
|
MEMS CAD |
OR2
|
Sensor
Integration |
OR3
|
MEMS and
Self-Assembly |
CODE |
TOPIC |
SCOPE |
1 |
Materials/Process
Technologies |
Materials
for Sensors, Nano Materials, Bio Materials, Process Technology,
Integration Technology, Packaging
Optical Materials and Processes (Optical Fiber, Laser, Integrated
Optical Circuit, etc.)
Micromachining (Lithographic Methods, Precision Machining), Packaging
(Assembly, Bonding, Electric and Mechanical Interconnections),
Application of New Materials |
2 |
MEMS/Micromachine |
MEMS,
Micro/Nano-Structures, Actuators, Optical MEMS, RF-MEMS, Micropumps and
Valves, Microfluidic System, Scientific Instruments, Power MEMS
Design (Modeling, CAD/CAM Tools, Databases), Physics of Micro-Objects
(Properties Measurement, Analysis, Motion-Control)
Micro Chemical System (Micro TAS), Microreactors |
3 |
Physical Sensors |
Pressure,
Vacuum, Acoustic, Position, Speed, Acceleration, Angular Rate, Flow and
Other Mechanical Sensors, Temperature Sensors, Infrared Sensor, Visible
Light Sensor, Ultraviolet Sensor, Radiation Sensor, Magnetic Sensors
|
4 |
Bio/Chemical Sensors |
Bio/Chemical
Sensor, Gas Sensor, Humidity Sensor, Ion Sensor, Bio-Sensor, Odor
Sensor, Taste Sensor, DNA Chip, Proteomic Analysis
|
5 |
Systems |
Sensing
Systems (Signal Processing, Sensor Array, Multi-Function Sensor, etc.),
Sensing Algorithm (Active Sensing, Sensor Fusion), Sensing Function
Mimicking Human Senses, Biometric Sensor, Application Technology
(Automobile, Medical and Welfare Applications, Robotics, Industrial
Measurement, Environmental Measurement, etc.), Ubiquitous System,
Network Sensors, Human Interface
|
6 |
Nanotechnology and
Emerging Technologies |
Tools for
Nanotechnology, Cell, DNA and Biomolecular Handling, Sensing Extreme
Phenomena (Extremely Weak Light, Single Electron Detection, Extremely
High Vacuum, Extremely High Speed)
Quantum Effect Sensing (Quantum Effect Device, Super-Conductor, etc.)
Micro Probe Sensing (Scanning Probe Microscopy, Field Emission, Vacuum
MicroElectronics, etc.), NEMS, Near Field Optics, Photonic Crystal |
Authors of accepted abstracts are to pay Submission Fee
of 20,000 yen for 4 page manuscripts or 25,000 yen for 5 or 6 page
manuscripts by the date which will be informed later. Authors will
receive an invoice for Submission Fee. Late News Submission Fee is
10,000 yen. (Consumption tax will be added to the fee.)
Page |
Submission
Fee |
4 page
manuscripts |
20,000
yen |
5 or 6
page
manuscripts |
25,000
yen |
Late News |
10,000
yen |
Manuscript Preparation Guideline (PDF)
Sample Abstract for Manuscript for Book of Abstracts (PDF)
A limited number of late news will be accepted. The
authors who wish to present late news must submit one page (A4) camera
ready abstract, including the title of the article, names of authors,
institutions, figures and tables. Accepted late news will appear in
Book of Abstracts. Deadline for late news submission is Tuesday,
September 18, 2007.
As to the sample format, please refer to the sample abstract for
Manuscript Preparation section above.
|
Member,
IEEJ or other sponsoring
institutions (No subject to tax) |
Non-member
(Including tax) |
Student |
PRE-REGISTRATION
(Now CLOSED) |
20,000
yen |
25,000
yen |
4,000
yen |
ON-SITE
REGISTRATION |
30,000
yen |
35,000 yen |
4,000
yen |
Fee includes a copy of Book of Abstracts, Proceedings
and CD-ROM.
Registration information shall be available as soon as it is ready.
Payment for pre-registration should be made before the deadline.
On-line pre-registration is now closed. Please
download Registration Form and fill out
the necessary information and
register on-site.
For inforatmaion on exhibition opportunity, please
contact the secretariat at SMAS@conferences.jp
The 24th Sensor Symposium
c/o Echizen and Associates, Tokan Shinjuku Bldg. 603, Nishi-Shinjuku
3-6-5, Shinjuku, Tokyo, 160-0023, Japan
fax 81-3-3346-8002, phone 81-3-3346-8007, SMAS@conferences.jp
|