Title: The 23rd Sensor Symposium on Sensors, Micromachine and Applied Systems
Date: October 5-6, 2006
Venue: Sunport Takamatsu, Kagawa
(Sun Port 2-1, Takamatsu, Kagawa, 2 minute walk from JR Takamatsu St.)
Sponsored by: Sensors and Micromachine Sub-Society of the Institute of Electrical Engineers of Japan
Co-Sponsored by: The Electrochemical Society of Japan, The Institute of Electronics, Information and Communication Engineers, The Institute of Systems, Control and Information Engineers, The Ion Engineering Society of Japan, The Japan Society for Precision Engineering, The Japan Society of Applied Physics, The Japan Society of Infrared Science and Technology, The Japan Society of Mechanical Engineers, Japan Society of Medical Electronics and Biological Engineering, The Japan Society of Next Generation Sensor Technology, The Laser Society of Japan, New Ceramics Forum, Reliability Engineering Association of Japan, The Robotics Society of Japan, The Society of Instrument and Control Engineers, The Society of Sensing Technology of Japan, The Vacuum Society of Japan and Related Technical Committees of IEEJ
General Chair: Susumu Sugiyama (Ritsumeikan University)
Program Chair: Koichi Imanaka (Omron Corporation)
URL: http://www2.iee.or.jp/~smas//


Steering Committee

General Chair Susumu Sugiyama (Ritsumeikan University)
Secretariat Kaoru Yamashita (Osaka University)
Secretariat Toshiyuki Toriyama (Ritsumeikan University)
Program Chair Koichi Imanaka (Omron Corporation)
Program Vice Chair Gen Hashiguchi (Kagawa University)
Program Secretariat Fumihiko Sato (Omron Corporation)
Finance Chair Hideto Iwaoka (Kanazawa Institute of Technology)
Local Arrangement Chair Fumikazu Oohira (Kagawa University)
Exhibition Chair Masafumi Kimata (Ritsumeikan University)

Program Committee

Program Chair Koichi Imanaka (Omron Corporation)
Program Vice Chair Gen Hashiguchi (Kagawa University)
Program Secretariat Fumihiko Sato (Omron Corporation)
Memberst Hiroshi Adachi (Muroran Institute of Technology)
Hirofumi Funabashi (Toyota Central Research & Development Laboratories, Inc.)
Seiichi Hata (Tokyo Institute of Technology)
Masaki Hirota (Nissan Motor Co., Ltd.)
Hideto Iwaoka (Kanazawa Institute of Technology)
Nobuaki Kawahara (Denso Corporation)
Hiroshi Kezuka (Tokyo University of Technology)
Masafumi Kimata (Ritsumeikan University)
Setsuo Kodato (Tokyo Institute of Technology)
Kazusuke Maenaka (University of Hyogo)
Yuji Miyahara (National Institute of Materials Science)
Hiroshi Miyajima (Olympus Corporation)
Toyosaka Moriizumi (Tokyo Institute of Technology)
Yuji Murakami (Toray Industries, Inc.)
Takamichi Nakamoto (Tokyo Institute of Technology)
Takahito Ono (Tohoku University)
Fumikazu Oohira (Kagawa University)
Minoru Sasaki (Tohoku University)
Kazuaki Sawada (Toyohashi University of Technology)
Renshi Sawada (Kyushu University)
Mitsuhiro Shikida (Nagoya University)
Hiroyuki Shinoda (The University of Tokyo)
Shuichi Shoji (Waseda University)
Hiroaki Suzuki (University of Tsukuba)
Jun Tamaki (Ritsumeikan University)
Shuji Tanaka (Tohoku University)
Kiyoshi Toko (Kyushu University)
Toshiyuki Toriyama (Ritsumeikan University)
Toshiyuki Tsuchiya (Kyoto University)
Yoshinori Uchikawa (Tokyo Denki University)
Tetsuya Watanabe (Yokogawa Electric Corporation)
Kaoru Yamashita (Osaka University)


The symposium will present recent scientific and technological results on all aspects of the theory, design, fabrication and application of sensor and micromechanical systems, and promote exchange of ideas and techniques among the scientists. This year, there will be four organized sessions on special topics, which are 1. Energy and MEMS, 2. Display and MEMS, 3. Robot and MEMS, and 4. Disaster Prevention and Sensor.


Japanese and English are to be used in the presentations. Symposium proceedings will be published in English.


Accepted papers are to be presented in Oral or Poster presentations.
Presenters may use Japanese or English for presentation.

Oral Presentation: Authors will have 20 minutes for oral presentation including 5 minute discussion with audience. Presentation rooms will be provided with overhead projector and PC projector.

Poster Presentation: Authors are to present their papers as posters. During poster session, authors are to stand by their posters to have discussion with audience.


Igarashi award is presented to commend a paper presented by young researchers, aged 35 years or younger at the time of Symposium.

Best Poster Award is presented to the best poster presenter.

Best Technical Exhibition Award is presented to the best technical exhibitor.

Paper Submission

Authors wishing to present a paper at the symposium should submit the following materials. All accepted papers must be presented at the conference.

1)4 copies of an abstract, with a title and a summary not exceeding 500 words on one page. For figures you may use the other side. Please type your abstract on A4 size or the legal letter size paper. Explain originality and usefulness of your work. Names and affiliations of authors should not appear on the abstract.

2)1 copy of application form containing the following information
1. title of the paper
2. names of all authors
3. name and date of birth of the presenter (required for screening purpose of the Igarashi Award*)
4. mailing address of a contact person
5. telephone and facsimile numbers, and E-mail address of the above contact person
6. topic code number(s) selected from the list below
7. preference for poster or oral presentation

A sample of application form (PDF format) is available from here.

The abstract should be sent to:
The 23rd Sensor Symposium,
c/o ECHIZEN, Tokan Shinjuku Bldg. 603, Nishi-Shinjuku 3-6-5, Shinjuku, Tokyo, 160-0023, Japan
fax 81-3-3346-8002, phone 81-3-3346-8007, SMAS@conferences.jp

Deadline for abstract submission is Monday, May 8, 2006.

Organized Session TOPIC
OR1 Energy and MEMS
OR2 Display and MEMS
OR3 Robot and MEMS
OR4 Disaster Prevention and Sensor

1 Materials/Process Technologies Materials for Sensors, Nano Materials, Bio Materials, Process Technology, Integration Technology, Packaging
Optical Materials and Processes (Optical Fiber, Laser, Integrated Optical Circuit, etc.)
Micromachining (Lithographic Methods, Precision Machining), Packaging (Assembly, Bonding, Electric and Mechanical Interconnections), Application of New Materials
MEMS/Micromachine MEMS, Micro/Nano-Structures, Actuators, Optical MEMS, RF-MEMS, Micropumps and Valves, Microfluidic System, Scientific Instruments, Power MEMS
Design (Modeling, CAD/CAM Tools, Databases), Physics of Micro-Objects (Properties Measurement, Analysis, Motion-Control)
Micro Chemical System (Micro TAS), Microreactors  
3 Physical Sensors Pressure, Vacuum, Acoustic, Position, Speed, Acceleration, Angular Rate, Flow and Other Mechanical Sensors, Temperature Sensors, Infrared Sensor, Visible Light Sensor, Ultraviolet Sensor, Radiation Sensor, Magnetic Sensors
4 Bio/Chemical Sensors Bio/Chemical Sensor, Gas Sensor, Humidity Sensor, Ion Sensor, Bio-Sensor, Odor Sensor, Taste Sensor, DNA Chip, Proteomic Analysis
5 Systems Sensing Systems (Signal Processing, Sensor Array, Multi-Function Sensor, etc.), Sensing Algorithm (Active Sensing, Sensor Fusion), Sensing Function Mimicking Human Senses, Biometric Sensor, Application Technology (Automobile, Medical and Welfare Applications, Robotics, Industrial Measurement, Environmental Measurement, etc.), Ubiquitous System, Network Sensors, Human Interface
6 Nanotechnology and Emerging Technologies Tools for Nanotechnology, Cell, DNA and Biomolecular Handling, Sensing Extreme Phenomena (Extremely Weak Light, Single Electron Detection, Extremely High Vacuum, Extremely High Speed)
Quantum Effect Sensing (Quantum Effect Device, Super-Conductor, etc.)
Micro Probe Sensing (Scanning Probe Microscopy, Field Emission, Vacuum MicroElectronics, etc.), NEMS, Near Field Optics, Photonic Crystal

Submission Fee (Consumption tax will be added to the fee.)

Authors of accepted abstracts are to pay Submission Fee of 20,000 yen for 4 page manuscripts or 25,000 yen for 5 or 6 page manuscripts by the date which will be informed later. Authors will receive an invoice for Submission Fee. Late News Submission Fee is 6,000 yen. (Consumption tax will be added to the fee.)

Page Submission Fee
4 page manuscripts 20,000 yen
5 or 6 page
25,000 yen
Late News 6,000 yen

Cemera Ready Manuscripts for Book of Abstracts and The Proceeding Book

The information will be announced here.

Late News

The information will be announced here.

Registration Fee

Member, IEEJ or other sponsoring institutions (No subject to tax) Non-member (Including tax) Student
(Conpleted before September 15, 2006)
20,000yen 25,000yen 4,000yen
ON-SITE REGISTRATION 30,000yen 35,000yen 4,000yen

Fee includes a copy of Book of Abstracts, Proceedings and CD-ROM. Registration information shall be available as soon as it is ready. Payment for pre-registration should be made before the deadline.

Technical Exhibition

The information will be announced here.


The 23rd Sensor Symposium
c/o Echizen and Associates, Tokan Shinjuku Bldg. 603, Nishi-Shinjuku 3-6-5, Shinjuku, Tokyo, 160-0023, Japan
fax 81-3-3346-8002, phone 81-3-3346-8007, SMAS@conferences.jp